AI CORE X

Overview

The Intel® Movidius™ Myriad™ X VPU is a giant leap over the previous generation of VPUs. It can reach up to 105 FPS (80 typical) and can perform over 1 trillion floating-point operations per second as a dedicated neural-network accelerator. The Intel® Movidius™ Myriad™ X is capable of processing video and performing facial recognition in real-time. Best of all, the Intel® Movidius™ Myriad™ X is an ultra-low-power VPU, needing very little energy to perform.

The AI Core X, part of the UP family from AAEON, is currently the only AI module powered by Intel® Movidius™ Myriad™ X available to purchase today. Built on the mPCIe form factor it is compact and built to work in a wide range of applications. AAEON and our partners have proven the capabilities of the AI Core X and UP Squared as a powerful AI edge computing platform. AAEON also offers a wide range of compact embedded boards which the AI Core X can easily be added to power machine vision and computer learning.

By working closely with Intel, AAEON has developed a wide range of AI solutions powered by Intel® Movidius™ Myriad™ X.

For more information, please check www.up-board.org, UP Community, UP Shop, or contact us directly.

Features

  • Intel® Movidius™ Myriad™ X VPU
  • 1x MYDX on mPCIe
  • Intel® Vision Accelerator Design SW SDK
  • Supported Framework: TensorFlow, Caffe, MXNET
  • Ubuntu 16.04, Windows® 10

Specifications [AI CORE X]

system
IC Intel Movidius Myriad X VPU, MA2485
Supported Frameworks Tensorflow, Caffe, MXNET
others
Form Factor Mini PCIe
Dimension 2.01″ x 1.18″ (51 mm x 30 mm)
Certification CE/FCC Class A
Operating Temperature 32 °F ~ 140 °F (0 °C ~ 60 °C)
Operating Humidity 10% ~ 80% relative humidity, non-condensing

Ordering Information [AI CORE X]

Part Number PER-TAICX-A10-001 PER-TAICX-A10-002 PER-TAICX-A10-003
description AI CORE Movidius™ Myriad™ X 2485. PCIe interface.Rev.A1.0 AI Core X mPCIe card. with single Myriad™ X. 15 mm heat sink with FAN AI Core X mPCIe card. with single Myriad™ X. w/o heat sink

Packing List

  • M2 screw x 1
  • AI Core X x 1

AI CORE XM 2280

Overview

The AI Core XM2280 is a compact m.2 AI module powered by Intel® Movidius™ Myriad™ X. It features two Intel® Movidius™ Myriad™ X VPUs, which together are capable of up to 200 fps (160 fps typical) and over 2 trillion floating-point operations per second as a dedicated neural-network accelerator. The AI Core XM2280 is compatible with Intel® Distribution of OpenVINO toolkit and supports Tensorflow and Caffe frameworks.

The Intel® Movidius™ Myriad™ X is built to have high performance with low power consumption. Together with the AI Core XM2280’s compact m.2 22x80mm size, the AI Core XM2280 is perfect for applications that are mobile or rely on battery power, such as drones or remote camera sensors.

The AI Core XM2280 is part of AAEON’s package of AI solutions and can be readily used with UP maker boards such as the Up Extreme, or with a wide range of embedded boards and systems in the AAEON catalogue.

By working closely with Intel, AAEON has developed a wide range of AI solutions powered by Intel® Movidius™ Myriad™ X.

For more information, please check www.up-board.org, UP Community, UP Shop, or contact us directly.

Features

  • Intel® Movidius™ Myriad™ X VPU
  • 2x MYDX on M.2 2280 B+M key
  • Intel® Vision Accelerator Design SW SDK
  • Supported Framework: TensorFlow, Caffe, MXNET
  • Ubuntu 16.04, Windows® 10

Specifications [AI CORE XM 2280]

system
IC Intel® Movidius™ Myriad™ X VPU x 2, MA2485
Supported Frameworks Tensorflow, Caffe, MXNET
others
Form Factor M.2 2280 B+M KEY
Dimension 3.15″ x 0.87″ (80 mm x 22 mm)
Certification CE/FCC Class A
Operating Temperature 32°F ~ 122°F (0°C ~ 50°C)
Operating Humidity 10% ~ 80% relative humidity, non-condensing

Ordering Information [AI CORE XM 2280]

Part Number PER-TAIX2-A10-2280
description AI CORE Movidius Myriad X 2485.M.2 2280 B+M key.Rev.A1.0

Packing List

  • M3 screw x 1
  • AI Core XM 2280 x 1

AI CORE XP4/ XP8

Overview

AAEON designed a PCIe[x4] card to accommodate 4 slot of AI Core XM 2280. The standard product will be based on 4x Intel® Movidius™ Myriad™ X on board, or 8x Intel® Movidius™ Myriad™ X on board. This could be a good way for you to try out how many Intel® Movidius™ Myriad™ X you really need for your project and help you to scale your vision accelerator.

By working closely with Intel, AAEON has developed a wide range of AI solutions powered by Intel® Movidius™ Myriad™ X.

For more information, please check www.up-board.org, UP Community, UP Shop, or contact us directly.

Features

  • PCIe x 4 Standard Full Length Low Profile Slot Card
  • Supports 4 x M.2 2280 M-Key
  • Intel® Movidius™ Myriad™ X VPU
  • Intel® Vision Accelerator Design SW SDK
  • Supported Framework: TensorFlow, Caffe, MXNET
  • Ubuntu 16.04, Windows® 10

Specifications [AI CORE XP4/ XP8]

system
IC Asmedia PCIe switch
Supported Frameworks Tensorflow, Caffe, MXNET
others
Form Factor PCIe x 4 card, full length, low profile
Dimension 4.37″ x 6.57″ (111 mm x 167 mm)
Certification CE/FCC Class A
Operating Temperature 32°F ~ 122°F (0°C ~ 50°C)
Operating Humidity 10% ~ 80% relative humidity, non-condensing

Ordering Information [AI CORE XP4/ XP8]

Part Number PER-TAIX4-A10-PCIE PER-TAIX8-A10-PCIE
description AI Core PCIe x 4 with 2 x AI Core XM 2280, fan heatsink AI Core PCIe x 4 with 4 x AI Core XM 2280, fan heatsink

Packing List

  • AI Core XP4/XP8

UP BOARD

Overview

UP is the computer board for Professional Makers and Industrial Applications

The extensive features included within UP make it the perfect solution for applications such as Robotics, Drone, Machine Vision, Smart Home, Education, Digital Signage, Intelligent Cars and Internet Of Things (IoT) solutions.

We created UP, the product, the community, and the shop to help professional makers and industrial customers create their products and be able to move to the next level: volume production. Thanks to the core of the embedded business, the UP board provides 2-years longevity and customization for the embedded customers.

UP is produced by AAEON, industrial embedded company of ASUS group. The UP team can access to all the necessary resources to modify UP in accordance with your requirements or to help you in transferring your project to UP platform.

For more information, please check www.up-board.org, or UP Community, or please check UP Shop to shop UP directly!

Features

  • Intel® Atom™ x5-Z8350 SoC
  • Onboard DDR3L Memory up to 4GB
  • Onboard eMMC Storage up to 64GB
  • Gigabit LAN x 1, USB 2.0 x 4, USB 3.0 x 1, HDMI x 1
  • 5V DC-in
  • 40 pin GPIO x 1
  • DSI/eDP x 1
  • MIPI-CSI x 1

Specifications [UP BOARD]

specifications
processor Intel® Atom™ x5-Z8350 Processor SoC
Graphics Intel® HD 400 Graphics, 12 EU GEN 8, up to 500MHz Support DX*11.1/12,
Open GL*42, Open CL* 1.2 OGL ES3.0, H.264, HEVC(decode), VP8
I/O HDMI x 1
I2S Audio port x 1
Camera MIPI-CSI (4 MEGA pixel)
USB USB 2.0 x4
USB 2.0 pin header (10 pins in total) x 2
USB3.0 OTG x 1
Expansion 40 pin General Purpose bus, supported by Altera Max V. ADC 8-bit@188ksos
RTC Yes
Power 5V DC-in @ 4A 5.5/2.1mm jack
Dimension 3.37”x 2.22”( 85.6mm x 56.5mm)
Memory 1GB/ 2GB/ 4GB DDR3L-1600
Storage eMMC 16GB / 32GB/ 64GB
Display Interface DSI/ eDP
Ethernet Gb Ethernet (full speed) RJ-45 x 1
OS support Win 10
Linux (ubilinux, Ubuntu, Yocto)
Android Marshmallow
Operating Temperature 32°F ~ 140°F (0°C ~ 60°C)
Operating Humidity 10% ~ 80% relative humidity, non-condensing
certificate CE/FCC Class A, RoHS Compliant

Ordering Information [UP BOARD]

Part Number UP-CHT01-A20-0116-A11 UP-CHT01-A20-0216-A11 UP-CHT01-A20-0232-A11 UP-CHT01-A20-0432-A11 UP-CHT01-A20-0464-A11
description UP board with z8350 CPU,
1GB RAM+16GB eMMC, passive heatsink
UP board with z8350 CPU,
2GB RAM+16GB eMMC, passive heatsink
UP board with z8350 CPU,
2GB RAM+32GB eMMC, passive heatsink
UP board with z8350 CPU,
4GB RAM+32GB eMMC, passive heatsink
UP board with z8350 CPU,
4GB RAM+64GB eMMC, passive heatsink

Packing List

  • UP-CHT01 with Heatsink

UP CORE

Overview

UP Core is a miniature board with the high performance and low power consumption features of the latest tablet technology: the Intel® Atom™ x5 Z8350 Processors (codename Cherry Trail) 64 bits up to 1.92GHz. The internal GPU is the new Intel Gen 8 HD 400 with 12 Execution Units up to 500MHz to deliver extremely high 3D graphic performance.

UP Core is equipped with 1GB/2GB/4GB DDR3L RAM and 16GB/32GB/64GB eMMC. With 100-pin docking connector, UP Core provides the freedom to makers to build up their carrier board. There are more interfaces available, such as 2x port USB2.0 + 1x UART on header, 1x USB 3.0 host, WiFi, Bluetooth 1x DSI/eDP port, 2x Camera (MIPI-CSI), 1x HMDI, RTC.

When it comes to security, UP Core has Intel security features needed for professional IoT applications such Intel AES New Instructions and Intel Identity Protection Technology.

It’s UP to you to choose which operation system is best for your application. The CPU is supported by Android 6.Marshmallow, Microsoft Windows 10 and we support and enable Linux, through our UP Community.

UP Core has a standard industrial PC operating temperature range of 32-140° F / 0-60°C, which makes it flexible for many applications.

For more information, please check www.up-board.org, or UP Community, or please check UP Shop to shop UP directly!

Features

  • Intel® Atom™ x5-Z8350 SoC
  • Onboard DDR3L Memory up to 4GB
  • Onboard eMMC Storage up to 64GB
  • DSI/eDP x 1, HDMI x 1
  • MIPI-CSI x 2
  • 100pin docking connector
  • WiFi+ Bluetooth
  • USB3.0 x 1

Specifications [UP CORE]

specifications
processor Intel® Atom™ x5-Z8350 Processor SoC
Graphics Intel® HD 400 Graphics
I/O Full eDP x 1
HDMI x 1
Audio via HDMI and I2C (from docking)
Camera MIPI-CSI (2 Lane)
MIPI-CSI (4 Lane)
USB USB 3.0 Host x 1
USB 2.0 pin header x 2
Expansion 100 pin docking connector
RTC Yes
Power 5V DC-in @ 4A 5.5/2.1mm jack
Dimension 56.50 mm × 66 mm
Memory 2GB / 4GB onboard DDR3L-1600
Storage eMMC 16GB / 32GB/ 64GB
Display Interface DSI/eDP x 1
Ethernet
OS support Win 10
Linux (ubilinux, Ubuntu, Yocto)
Android Marshmallow
Operating Temperature 32°F ~ 140°F (0°C ~ 60°C)
Operating Humidity 10% ~ 80% relative humidity, non-condensing
certificate CE/FCC Class A, RoHS compliant, REACH

Ordering Information [UP CORE]

Part Number UPC-CHT01-A20-0116-A11 UPC-CHT01-A20-0216-A11 UPC-CHT01-A20-0232-A11 UPC-CHT01-A20-0432-A11 UPC-CHT01-A20-0464-A11
description UP Core with z8350 CPU, 1GB RAM + 16GB eMMC, passive heatsink, WIFI 802.11 b/g/n + Bluetooth 4.2 on board powered by AMPAK AP6214A UP Core with z8350 CPU, 2GB RAM + 16GB eMMC, passive heatsink, WIFI 802.11 b/g/n + Bluetooth 4.2 on board powered by AMPAK AP6214A UP Core with z8350 CPU, 2GB RAM + 32GB eMMC, passive heatsink, WIFI 802.11 b/g/n + Bluetooth 4.2 on board powered by AMPAK AP6214A UP Core with z8350 CPU,4GB RAM + 32GB eMMC, passive heatsink, WIFI 802.11 b/g/n + Bluetooth 4.2 on board powered by AMPAK AP6214A UP Core with z8350 CPU, 4GB RAM + 64GB eMMC, passive heatsink, WIFI 802.11 b/g/n + Bluetooth 4.2 on board powered by AMPAK AP6214A

Packing List

  • UPC-CHT01 with Heatsink

UP SQUARED

Overview

UP Squared (UP²) is world’s fastest maker board with the high performance and low power consumption features of Intel® Celeron™, Pentium™ and Atom™ Processors (codename Apollo Lake).

The internal GPU is the new Intel® Gen. 9 HD with 12/18 Execution Units, supporting 4K Codec Decode and Encode for HEVC⁴, H.264 and VP8. Thanks to the Vector Units Image Processing Unit and Precision Timing Management to synchronize CPU with I/O, improved determinism (cache QoS, Intel Virtualization Technology), all the graphic processing is effortless to UP Squared.

UP Squared comes with 2GB/4GB/8GB LPDDR4 and 32GB/64GB/128GB eMMC. A 40-pin GP-bus provides the freedom for makers to build up their module. Additionally, there is a 60-pin EXHAT for embedded applications. This allows for the exploration of more possibilities. The expansion capabilities of UP2 (UP Squared) goes much further than this. Native mini-PCI-e, M.2 2230 and SATA3 are all built in on the board.

UP Squared supports the AI Core X mPCIe module, which features Intel Movidius Myriad X. With speeds up to 105 fps (80 typical) and 1 trillion floating point operations, adding on the AI Core X to UP Squared creates a powerful, compact AI Edge solution. UP Squared with AI Core X has proven real-world performance, used by AAEON partners in applications from license plate recognition to drone-based visual inspections.

The board supports Windows 10, Windows IoT Core, Ubilinux, Ubuntu, Yocto and Android Nougat. It’s really UP to you to decide which operating system is best for your application. Now, all you need is an UP Squared to begin your project! If you need a complete system for your project, check out the UP Squared System “UPS-GWS01”.

For more information, please check www.up-board.org, or UP Community, or please check UP Shop to shop UP directly!

Features

  • Intel® Pentium® N4200/ Celeron® N3350 Processor SoC
  • Onboard LPDDR4 Memory up to 8GB
  • Onboard eMMC Storage up to 128GB
  • Gigabit LAN x 2, USB 2.0 x 2, USB 3.0 (Type A) x 3
  • 5V DC-in, 4-6A
  • 40 pin GPIO x 1
  • DP/eDP/HDMI x 1
  • MIPI-CSI (4-Lane & 2-Lane) x 1
  • Mini-PCIe /M.2 2230 x 1
  • SATA3 x 1
  • 60pin EXHAT

Specifications [UP SQUARED]

specifications
processor Intel® Pentium® N4200/ Celeron® N3350/ Atom™ E3940/ E3950 Processor
SoC
Graphics Intel® Gen 9 HD, supporting 4K Codec Decode and Encode for HEVC4, H.264, VP8
I/O HDMI x 1
DP x 1
I2S Audio Port
Camera CSI 2-lane + CSI 4-lane
USB USB 2.0 x 2
USB3.0 OTG x 1
USB3.0 (Type A) x 3
Expansion 40 pin GPIO x 1
Mini-PCIe x 1
M.2 2230 x 1
SATA3 x 1
60 pin EXHAT x 1
RTC Yes
Power 5V DC-in @ 4A-6A
Dimension 3.37″ x 3.54″ (85.6 mm × 90 mm)
Memory 2GB ( single channel) LPDDR4
4GB/8GB ( dual channel) LPDDR4)
Storage eMMC 32 GB / 64 GB / 128 GB
Display Interface eDP
Ethernet Gb Ethernet (full speed) RJ-45 x 2
OS support Microsoft Windows 10 (full), Windows IOT Core, Linux
(ubilinux, Ubuntu, Yocto), Android Nougat
Operating Temperature 32°F ~ 140°F (0°C ~ 60°C)
Operating Humidity 0%~90% relative humidity, non-condensing
certificate CE/FCC Class A, RoHS complaint, REACH

Ordering Information [UP SQUARED]

Part Number UPS-APLC2F-A20-0232 UPS-APLC2F-A20-0432 UPS-APLP4F-A20-0432 UPS-APLP4F-A20-08128 UPS-APLP4F-A20-0864 UPS-APLX5F-A20-0432 UPS-APLX7F-A20-0464 UPS-APLX7F-A20-0864
description UP² (UP Squared) board with Intel® Celeron® Dual Core N3350(F1) up to 2.4GHz, on board 2GB DDR4, 32GB eMMC UP² (UP Squared) board with Intel® Celeron® Dual Core N3350(F1) up to 2.4GHz, on board 4GB DDR4, 32GB eMMC UP² (UP Squared) board with Intel® Pentium® N4200(F1) Quad Core up to 2.5 GHz, on board 4GB DDR4, 32GB eMMC UP² (UP Squared) board with Intel® Pentium® N4200(F1) Quad Core up to 2.5 GHz, on board 8GB DDR4, 128GB eMMC UP² (UP Squared) board with Intel® Pentium® N4200(F1) Quad Core up to 2.5 GHz, on board 8GB DDR4, 64GB eMMC UP² (UP Squared) board with Intel® Atom™ E3940(F1).4G memory 32G eMMC.Rev.1.0 0464 UP² (UP Squared) board with Intel® Atom™ E3950(F1).4G memory 64G eMMC.Rev.1.0 UP² (UP Squared) board with Intel® Atom™ E3950(F1).8G memory 64G eMMC.Rev.1.0

Packing List

  • UPS-APL with Heatsink

Optional Accessories

1702020910 Power cord for EU
1702020911 Power cord for US
1255300362 30W.5VDC/6A power adapter
PER-TAICX-A10-001 AI Core X mPCIe card.with 30 mm heat sink
PER-TAICX-A10-002 AI Core X mPCIe card.with 15 mm heat sink with FAN

UP Squared i12 Edge

Industrial Automation and IoT Gateway
The UP Squared i12 Edge is the ideal compact solution for optimizing manufacturing processes. CNVi support via an M.2 2230 E-Key offers wireless data exchange with retrofitted factory equipment, while the high bandwidth offered by the PC™s LPDDR5 system memory allows for faster data acquisition from sensors and cameras. This enables inferencing functions such as anomaly detection for predictive maintenance to be performed by its 12th Gen Intel® Core processors without latency.

Parking Management
With its robust processing capabilities and AI module support through an M.2 2280 M-Key interface, the UP Squared i12 Edge is well-suited for a range of applications that depend on Automatic Number Plate Recognition (ANPR), including smart parking structures. By connecting with peripheral devices, the system can effectively monitor parking lot occupancy. Furthermore, it can transmit this information to users through high-definition displays using its HDMI 1.4b/DP 1.2 stack connector, as well as DP 1.4a via the USB Type-C port.

Toll Plaza
When a vehicle enters a toll plaza , the system’s advanced processing and inferencing capabilities can identify key parameters such as vehicle type and distance covered. This data can then be analyzed to determine the appropriate toll payable. Further demonstrating its suitability is the PC’s blend of ample onboard and expandable storage. Such features facilitate the collection, processing, and analysis of data directly on the edge. Additionally, this data secured through the hardware-based encryption of onboard TPM 2.0.

AGV
12th Gen Intel® Core processors enable precise path-planning, a crucial aspect for applications like automated guided vehicles (AGVs) . Further, onboard LPDDR5 system memory ensures rapid data transmission at the edge. This UP Squared i12 Edge is also equipped with interfaces that include dual LAN and three USB 3.2 Gen 2 ports in a fanless chassis, with compact dimensions measuring just 130mm x 94mm x 68mm. This compact powerhouse holds the potential to emerge as a sophisticated and energy-efficient solution for AGV purposes.

Features

  • 12th Generation Intel® Core i7/i5/i3/Celeron® Processor SoC
  • Up to 16GB Onboard LPDDR5
  • Up to 128GB Onboard SSD
  • M.2 2230 E-Key/M.2 2280 M-Key/SATA III x 1
  • 1GbE x 2
  • HDMI 1.4b x 1, DP 1.2 x 1, DP 1.4a via USB Type-C x 1
  • USB 3.2 x 3 (Type A x 2, Type C x 1)
  • Audio Jack x 1 (Line out + Mic in)
  • 12V DC-in
  • TPM 2.0

Specifications [UP SQUARED I12 EDGE]

system
CPU 12th Gen Intel® Core Processor SoC
Intel® Core i7-1270PE (28W)
Intel® Core i7-1260P (28W)
Intel® Core i5-1250PE (28W)
Intel® Core i5-1240P (28W)
Intel® Core i3-1220PE (28W)
Intel® Celeron® Processor 7305E (15W)
Memory Up to 16GB Onboard LPDDR5 (Single-Channel)
Graphics Intel® UHD Graphics
Storage Up to 128GB Onboard SSD
M.2 2280 M-Key NVMe x 1 (PCIe Gen 4.0 [x4])
SATA III x 1
Ethernet 1GbE RJ45 x 2 (Dual Stacked) (Realtek 8111H CG)
WIFI/BT Optional: M.2 2230 E-Key
Expansion Slot M.2 2230 E-Key x 1 (CNVI & PCIe Gen 3.0 [x1])
M.2 2280 M-Key NVMe x 1 (PCIe Gen 4.0 [x4])
SATA III x 1
Security Onboard TPM 2.0
OS support Windows® 10 IoT Enterprise
Ubuntu 22.04 LTS
Yocto 4
i/o placements
USB USB 3.2 Gen 2 (Type A) x 2
USB 3.2 Gen2 (Type C) x 1
DisplayPort HDMI 1.4b/DP 1.2 STACK Connector x 1
DP 1.4a x 1 (via USB Type-C)
Ethernet 1GbE RJ45 x 2 (Dual Stacked) (Realtek 8111H CG)
COM
Audio Audio Jack (Line out + MIC in) x 1
GPIO
power supply
Power Requirement 12V DC-in
Power Supply Type AT (default) /ATX
Power Consumption (Typical) 30W~36W
mechanical
Mounting VESA Mount/Wall Mount(Optional)
Dimensions (W x H x D) 5.12” x 3.7” x 2.68” (130mm x 94mm x 68mm)
Net Weight 1.87 lbs (0.85kg)
Gross Weight 2.36 lbs (1.07kg)
environment
Operating Temperature 32°F ~ 140°F (0°C ~ 60°C) / 0.5 airflow
Operating Humidity 0% ~ 90% relative humidity, non-condensing
Storage Temperature -4°F ~ 158°F (-20°C ~ 70°C)
MTBF 522,716
Certification CE/FCC Class A, RoHS Compliant, REACH

Ordering Information [UP SQUARED I12 EDGE]

Part Number UPS-EDGE-ADLPCR-A10-0864 UPS-EDGE-ADLPI3-A10-08128 UPS-EDGE-ADLPI5-A10-08128 UPS-EDGE-ADLPI5C-A10-08128 UPS-EDGE-ADLPI7-A10-16128 UPS-EDGE-ADLPI7C-A10-16128
cpu Intel® Celeron® Processor 7305E Intel® Core i3-1220PE Intel® Core i5-1250PE Intel® Core i5-1240P Intel® Core i7-1270PE Intel® Core i7-1260P
core 1P + 4E 4P + 4E 4P + 8E 4P + 8E 4P + 8E 4P + 8E
memory 8GB 8GB 8GB 8GB 16GB 16GB
storage 64GB 128GB 128GB 128GB 128GB 128GB

Optional Accessories

Part Number Description
1255X00088 Power adapter: (TF)AC/DC Adapter.100-240VAC/2A.120W.12VDC/10A.PLUG 2.1mm.FSP.FSP120-AHAN3
1702031803 Power cord for EU: (TF)POWER CORD.3P-250V 10A 180D.1.8M.VDE.FAN-JET.YP-22/YC-12
1702031802 Power cord for US: (TF)POWER CORD.3P-125V 10A 180D.1.8M.USA.FANJET.YP12/YC-12
170203180J Power cord for UK: (TF)Power Cord.3P.250V 10A.UK type.1830mm
170203180E Power cord for Japan: (TF)Power cord.3P.125V/7A.1.8M.PSE YP12/YC12 Certificat
170203180B Power cord for China: (TF)POWER CORD.3P(M).3P(F).1.8m.250V 10A 180D.CHINA.FAN-JET.YP-03/YC-12
1702031811 Power cord for Taiwan: (TF)Power Cord.3P-125VP.7A.180D.1.8M.TWN/BSMI.FANJET.YP-12/YC-12
9651926001 M.2 2230 WiFi Kit.802.11ac.2.4G/5G,W/BT w/2 cable & antenna
9741364A00 Wireless LAN Kit M.2 2230 802.11ac/a/b/g/n + BT4.0,2T2R,with 2 sets of cable & antenna

UP SQUARED PRO

Overview

The UP Squared Pro offers developers an up to date platform based on the popular UP Squared board, offering greater expandability and I/O features as well as support for 5G and AI accelerators. The UP Squared Pro is powered by the Intel® Celeron® N3350, Pentium® N4200 and Atom™ E3950 processors (formerly known as Apollo Lake) with up to 8GB of onboard memory to power automation or AI Edge Computing.

The UP Squared Pro provides greater expandability thanks to three M.2 slots, including M.2 2230 E-Key, M.2 2280 M-Key, and M.2 3042/3052 B-Key. This lets developers and users to quickly add on functionality such as Wi-Fi and AI accelerators such as the Intel® Movidius® Myriad™ X. The UP Squared Pro also supports 5G cellular cards, allowing developers to take advantage of lower latency and higher speeds for wireless network deployment. The UP Squared Pro features a 40-pin HAT expansion as well, and offers expandable storage with SATA III connectors.

The UP Squared Pro maintains and grows the familiar UP ecosystem, allowing developers to easily migrate projects from the UP Squared board to UP Squared Pro. UP Squared Pro is also compatible with the Intel® Distribution of OpenVINO® Toolkit, providing powerful software to help developers get their projects up and running quickly.

Features

  • Intel® Pentium® N4200/ Celeron® N3350/ Atom E3950 ™ Processor SoC
  • Onboard LPDDR4 Memory up to 8GB
  • Onboard eMMC Storage up to 64GB
  • Gigabit LAN x 2, USB 2.0 x 2, USB 3.2 Gen 1 (Type A) x 3
  • 12 VDC-in, 5A
  • 40 pin GPIO x 1
  • DP/eDP/HDMI x 1
  • M.2 2230 E-key x 1
  • M.2 2280 M-key x 1
  • SATA3 x 1
  • M.2 3042/3052 B-key x 1

Specifications [UP SQUARED PRO]

specifications
processor Intel® Pentium® N4200/ Celeron® N3350/ Atom™ E3950 Processor SoC
Graphics Intel® Gen 9 HD, supporting 4K Codec Decode and Encode for HEVC4, H.264, VP8
I/O HDMI x 1
DP x 1
COM port (RS422/RS232/RS485) x 2
Audio Jack x 1
Camera
USB USB 2.0 x 2
USB 3.2 Gen 1 OTG x 1
USB 3.2 Gen 1 (Type A) x 3
Expansion 40 pin GPIO x 1
M.2 2230 E-key x 1
M.2 2280 M-key x 1
SATA3 x 1
M.2 3042/3052 B-key x 1
RTC Yes
Power 12V-24V DC-in (Lockable plug)/ Phoenix connector (optional)
Dimension 10.16cm x 10.16cm
Memory 2GB (single channel) LPDDR4
4GB/8GB (dual channel) LPDDR4
Storage eMMC 32 GB / 64 GB
Display Interface HDMI2.0 x 1
DP1.2 x 1
eDP x 1
Ethernet Gb Ethernet (full speed) RJ-45 x 2
OS support Microsoft Windows 10 (full), Windows IOT Core
Linux: Ubuntu 18.04.5, Ubuntu 20.04.1
Operating Temperature with Fan: 32°F ~ 140°F (0°C ~ 60°C)
with Heatsink: 32°F ~ 122°F (0°C ~ 50°C)
Operating Humidity 0% ~ 90% relative humidity, non-condensing
certificate CE/FCC Class A, RoHS Compliant, REACH

Ordering Information [UP SQUARED PRO]

Part Number UPN-APLC2F-A10-0232 UPN-APLC2F-A10-0432 UPN-APLP4F-A10-0432 UPN-APLP4F-A10-0864 UPN-APLX7F-A10-0464
description UPN-APL01.CPU N3350(F1).Memory 2GB.eMMC 32GB.REV.A1.0 UPN-APL01.CPU N3350(F1).Memory 4GB.eMMC 32GB.REV.A1.0 UPN-APL01.CPU N4200(F1).Memory 4GB.eMMC 32GB.REV.A1.0 UPN-APL01.CPU N4200(F1).Memory 8GB.eMMC 64GB.REV.A1.0 UPN-APL01.CPU E3950(F1).Memory 4GB.eMMC 64GB.REV.A1.0

Packing List

  • UPN-APL01 with heatsink

Optional Accessories

1255X00032 12VDC/6A Adapter
1702031803 Power cord for EU
1702031802 Power cord for US
PER-TAIX2-A10-2280 AI Core XM M.2 2280 B+M key card 15mm heatsink with fan
9651926001 M.2 2230 WiFi Kit.802.11ac.2.4G/5G,W/BT w/2 cable & antenna
9741364A00 Wireless LAN Kit M.2 2230 802.11ac/a/b/g/n + BT4.0,2T2R,with 2 sets of cable & antenna

UP SQUARED PRO 7000 EDGE

With double the CPU and graphics performance, a denser I/O for peripheral device support, and a compact chassis with more accessible expansion options, the UP Squared Pro 7000 Edge brings ease to the edge. Equipped with Intel Atom® Processors x7000E Series, Intel® Core i3-N305 Processor, and Intel® Processor N Series Processors, the UP Squared Pro 7000 Edge has the capacity to power a wealth of peripheral cameras, sensors, and expansion modules in a compact, energy-efficient form factor.

UP Squared, Performance Doubled
Incorporating the most advanced CPUs from the Intel Atom® Processor x7000E Series, Intel® Core i3-N305 Processor, and Intel® Processor N Series Processors, the UP Squared Pro 7000 Edge is twice the machine of its predecessors. Up to 8 cores and 8 threads, Intel® UHD Graphics, and 16GB of onboard LPDDR5 respectively offer double the processing power, graphics execution units, system memory capacity and bandwidth of previous generations.

Accessible Expansion
With a more streamlined chassis design, users are able to access the UP Squared Pro 7000 Edge™s expansion slots and install 5G, Wi-Fi 6, and AI modules via a removable section of its heatsink, while the device™s rear I/O houses a 40-Pin GPIO. With reduced height dimensions, the UP Squared Pro 7000 Edge is also more suited to limited deployment spaces.

Improved Connection Potential
The UP Squared Pro 7000 Edge supports more peripheral devices than ever before, including three USB 3.2 and two COM ports for camera and sensor connectivity, in addition to a third display interface added in the form of DP 1.4a via USB Type-C, joining HDMI 2.0b and DP 1.2 ports for three simultaneous displays. These compliment the generation™s upgrade to two 2.5GbE LAN ports for superfast ethernet and IP camera support.

Features

  • Intel Atom® x7000E Series, Intel® Processor N-series, and Intel® Core i3-N305 Processor (formerly Alder Lake-N)
  • Onboard LPDDR5 Memory up to 16GB
  • Onboard eMMC Storage up to 64GB
  • 2.5GbE x 2 (Intel®i226-IT)
  • USB 3.2 x 3 (Type A x 2, Type C x 1)
  • 40 pin GPIO x 1
  • DP 1.2 x 1 / DP 1.4a x 1 / HDMI 2.0b
  • RS232 / 422 /485 x 2
  • M.2 2230 E-Key / M.2 2280 M-Key / M.2 3052 B-Key x 1
  • SATA III x 1
  • TPM 2.0
  • 12V DC-in, 6A

Specifications [UP SQUARED PRO 7000 EDGE]

system
CPU Intel® Core i3-N305
Intel Atom® x7425E
Intel® Processor N97
Intel® Processor N50
(formerly Alder Lake-N)
Memory Up to 16GB LPDDR5
Graphics Intel® UHD Graphics for 12th Gen Intel® Processors
Storage Up to 64GB eMMC
Ethernet 2.5GbE x 2 (Intel® i225/i226)
WIFI/BT Optional: M.2 2230 E-Key
Expansion Slot M.2 2230 E-Key x 1 (CNVI, PCIe Gen 3 [x1], USB 2.0)
M.2 2280 M-Key x 1 (PCIe Gen 3 [x2], USB 2.0)
M.2 3052 B-Key x 1 (USB 3.2 Gen 2)
SATA III x 1
Security Onboard TPM 2.0
OS support Windows® 10 IoT Enterprise
Ubuntu 22.04 LTS
Yocto 4
i/o placements
USB USB 3.2 Gen 2 x 2 (Type-A)
USB 3.2 Gen 2 x 1 (Type-C)
DisplayPort HDMI 2.0b x 1
DP 1.2 x 1
DP 1.4a via USB Type C
Ethernet 2.5GbE x 2 (Intel®i226-IT)
COM RS-232/422/485 x 2
Audio Audio Jack (Line out + MIC in) x 1
GPIO 40 pin GPIO x 1
power supply
Power Requirement 12V DC-in, 6A
Power Supply Type AT/ATX
Power Consumption (Typical) 26W~35W
mechanical
Mounting VESA Mounting
Dimensions (W x H x D) 5.27” x 4.13” x 2.56” (134mm x 105mm x 65mm)
Net Weight 2 lbs (0.95kg)
Gross Weight 2.8 lbs (1.3kg)
environment
Operating Temperature 32°F ~ 140°F (0°C ~ 60°) / 0.5 airflow
Operating Humidity 0% ~ 90% relative humidity, non-condensing
Storage Temperature -4°F ~ 158°F (-20°C ~ 70°C)
MTBF 422,053
Certification CE/FCC Class A, RoHS Compliant, REACH

Ordering Information [UP SQUARED PRO 7000 EDGE]

Part Number UPN-EDGE-ADLN50-A10-0432 UPN-EDGE-ADLN97-A10-0432 UPN-EDGE-ADLN97-A10-0864 UPN-EDGE-ADLNI3-A10-1664 UPN-EDGE-ADLNX25E-A10-0864
cpu Intel®Processor N50 Intel®Processor N97 Intel®Processor N97 Intel®Core i3-N305 Intel Atom® x7425E
memory 4GB 4GB 8GB 16GB 8GB
storage 32GB 32GB 64GB 64GB 64GB

Packing List

  • UP Squared Pro 7000 Edge

Optional Accessories

Part Number Description
1255X00032 12VDC/6A Adapter
1702031803 Power cord for EU
1702031802 Power cord for US
170203180J Power cord for UK
170203180E Power cord for Japan
170203180B Power cord for China
1702031811 Power cord for Taiwan
9651926001 M.2 2230 WiFi Kit.802.11ac.2.4G/5G,W/BT w/2 cable & antenna
9741364A00 Wireless LAN Kit M.2 2230 802.11ac/a/b/g/n + BT4.0,2T2R,with 2 sets of cable & antenna
UP-SATAKIT-A10-0001 SATA KIT for UPN-EDGE-APL01/UPN-EDGE-EHL01/UPN-EDGE-ADLN01

UP Squared Pro EDGE

UP Squared Pro EDGE System with Intel® Pentium® N4200/ Celeron® N3350/ Atom E3950 Processor SoC

Features

  • Intel® Pentium® N4200/ Celeron® N3350/ Atom E3950 Processor SoC
  • Onboard LPDDR4 Memory up to 8GB
  • Onboard eMMC Storage up to 64GB
  • Gigabit LAN x 2, USB 3.2 Gen 1 (Type A) x 3
  • 12-24 VDC-in, 5A
  • 16pin GPIO connector for 40 pin HAT
  • Audio Jack x 1 (line out + Mic)
  • SATA3 x 1

 


Specifications [UP SQUARED PRO EDGE]

system
CPU Intel® Apollo Lake N4200/N3350/E3950 Processor SoC
Memory onboard DDR4, Max 8GB
Single Channel:2GB
Dual Channel:4GB,8GB
Graphics Intel® Graphic ,Gen 9
Storage Emmc 32G/64G
Ethernet Intel i210 x2
WIFI/BT Optional
Expansion Slot 40 pin GPIO x 1
M.2 2230 E-key x 1
M.2 2280 M-key x 1
M.2 3052/3042 B-key x 1 (support with SIM)
SATA3 connector x 1 (support 2.5” HDD/SSD expansion)
Security
OS support Microsoft Windows 10 (full), Windows IOT Core
Linux: Ubuntu 18.04.5 & Ubuntu 20.04.1
Yocto 3.1
i/o placements
USB USB3.2 Gen1 OTG x 1
USB3.2 Gen1 (Type A) x 3
DisplayPort HDMIx1, DP x1
Ethernet Gb Ethernet (full speed) RJ-45 x 2 ( Intel i210)
COM RS422/RS232/RS485 x 2
Audio Line out+mic in x1
GPIO
power supply
Power Requirement 12-24VDC
Power Supply Type
Power Consumption (Typical)
mechanical
Mounting
Dimensions (W x H x D) 4.61” x4.19” x3.5” (117mm x 106.5mm x 88.8mm)
Net Weight
Gross Weight 2.17 lb (982.5g)
environment
Operating Temperature 32°F ~ 140°F (0°C ~ 55°C) with air flow 0.5m/s
Operating Humidity 0% ~ 90% relative humidity, non-condensing
Storage Temperature
MTBF
Certification CE/FCC Class A, RoHS Compliant , REACH

Ordering Information [UP SQUARED PRO EDGE]

Part Number UPN-EDGE-APLC2F-A10-0232 UPN-EDGE-APLC2F-A10-0432 UPN-EDGE-APLP4F-A10-0432 UPN-EDGE-APLP4F-A10-0864 UPN-EDGE-APLX7F-A10-0464
description UPN-EDGE-APL01.CPU N3350(F1).Memory 2GB.eMMC 32GB.REV.A1.0 UPN-EDGE-APL01.CPU N3350(F1).Memory 4GB.eMMC 32GB.REV.A1.0 UPN-EDGE-APL01.CPU N4200(F1).Memory 4GB.eMMC 32GB.REV.A1.0 UPN-EDGE-APL01.CPU N4200(F1).Memory 8GB.eMMC 64GB.REV.A1.0 UPN-EDGE-APL01.CPU E3950(F1).Memory 4GB.eMMC 64GB.REV.A1.0

Packing List

  • UPN-EDGE PRO

Optional Accessories

1255X00032 12VDC/6A Adapter
1702031803 Power cord for EU
1702031802 Power cord for US
9651926001 M.2 2230 WiFi Kit.802.11ac.2.4G/5G,W/BT w/2 cable & antenna
9741364A00 Wireless LAN Kit M.2 2230 802.11ac/a/b/g/n + BT4.0,2T2R,with 2 sets of cable & antenna

UP XTREME

Overview

The UP Xtreme is the third generation of UP Board products, powered by 8th Generation Intel® Core™ and Celeron® processors (formerly Whiskey Lake) with up to 16GB of onboard RAM and 64GB of eMMC memory to power through any application. With the latest Intel® graphics solution, the UP Xtreme is capable of 4K video output and features a built-in audio jack as standard.

The UP Xtreme brings industrial-grade features to the UP line of products, such as 12~60V wide voltage power input, two RS232/422/485 10-pin headers, and time-sensitive networking (TSN) to facilitate communication in a connected factory. The UP Xtreme is also built to perform in temperatures ranging from 0°C up to 60°C.

The UP Xtreme offers flexible expandability with both a 40-pin and 100-pin connector, as well as m.2 2230 and 2280 slots, and mPCIe slots. The UP Xtreme can be expanded with wireless modules for Wi-Fi, Bluetooth, 4G and LTE. The UP Xtreme is compatible with other UP Board modules, including the AI Core X, AI Core XM 2280, and Vision Plus X, all featuring the Intel® Movidius™ Myriad™ X. With each module installed, the UP Xtreme supports up to six Intel® Movidius™ Myriad™ X modules, providing high-performance AI processing for edge computing applications.

Users can also get the UP Xtreme in a pre-built system, the UP Xtreme Edge (UPX Edge). The rugged UPX Edge can operate in conditions as cold as -20°C up to 70°C with the AI Core XM 2280 modules (two Intel® Movidius™ Myriad™ X VPUs).

Features

  • Intel® WHL-U Core i7/i5/i3/Celeron® Processor SoC
  • Onboard DDR4 memory, Max 16GB
  • eMMC 64GB
  • 40Pin HAT Connector
  • 100pin docking connector
  • SATA 6.0Gb/s x 3
  • Mini-card slot x 1
  • M.2 2280 M key x 1
  • M.2 2230 E key x 1
  • Audio Jack x 1 (line out + Mic)
  • Lockable DC connector

Specifications [UP XTREME]

specifications
processor 8th generation Intel® Core i7/i5/i3/Celeron Processor SoC
Graphics Intel® Graphics , GEN 9
I/O RJ45 Ethernet Connector x 2
HDMI/DP STACK Connector x 1
Power Button / LED x 1
Audio Jack (Line out + MIC) x 1
DC connector (Lockable) x 1
STM32 connector x 1
eDP with Backlight control Header x 1
10 pin 1xUSB2.0 x 1 / HSUART (TTL) x 1
SATA Connector with power connector (5V, GND) x 1
4 pin Fan connector x1
Power Button header x 1
Reset Pin header x 1
M.2 2230 E Key x 1
M.2 2280 M Key x 1
40 pin HAT connector x 1
mPCIe slot x 1
10 pin RS232/422/485 pin header x 2
100pin connector x 1
Camera
USB USB 3.2 Gen 2 STACK Connector for 2 ports (Front) x 1
USB 3.2 Gen 2 STACK Connector for 2 ports (Rear) x 1
Expansion M.2 2230 E Key x 1
M.2 2280 M key x 1
mPCIe slot x 1
100pin connector x 1
40pin HAT
RTC RTC battery, CR2032 x 1
Power 12V – 60VDC
Dimension 122 x 120 mm
Memory Onboard DDR4 memory, Max 16GB
Single Channel: 4GB
Dual Channel: 8GB, 16GB
Storage SATA3 (6Gb/s) x 3:
a.SATA connector x 1
b. M.2 2280 SATA option (auto detect) x 1
c. minicard mSATA option (auto detect) x 1
Display Interface HDMI2.0 x 1
DP1.2 x 1
eDP x 1
CEC support with STM32 on HDMI x 1
Ethernet i7/i5 SKU LAN (i210 AT) x 1, LAN (i219 LM) x 1
i3/Celeron® LAN (i210 AT) x 1, LAN (i219 V) x 1
OS support Win 10
Linux Ubuntu 18.04 with Kernel 5.0
Linux Yocto 2.7 with Kernel 4.19
Operating Temperature 0 ~ 60°C (32 ~ 140°F)
Operating Humidity 0% ~ 90% relative humidity, non-condensing
certificate CE/FCC class A, RoHS Compliant, REACH

Ordering Information [UP XTREME]

Part Number UPX-WHLCR-A20-04064 UPX-WHLI3-A20-08064 UPX-WHLI5-A20-08064 UPX-WHLI7-A20-16064 UPX-WHLI7C-A20-16064
cpu Celeron 4305UE Core I3-8145UE Core I5-8365UE Core I7-8665UE Core I7-8565U
ram 4GB 8GB 8GB 16GB 16GB
storage 64GB 64GB 64GB 64GB 64GB
lan GbE x 2 GbE x 2 GbE x 2 GbE x 2 GbE x 2
usb USB 3.2 Gen 2 x 4
USB 2.0 x 1
USB 3.2 Gen 2 x 4
USB 2.0 x 1
USB 3.2 Gen 2 x 4
USB 2.0 x 1
USB 3.2 Gen 2 x 4
USB 2.0 x 1
USB 3.2 Gen 2 x 4
USB 2.0 x 1
rs-232/422/485 2 2 2 2 2
expansion slot Mini card x 1,
M.2 2280 B + M key x 1,
M.2 2230 E key x 1
Mini card x 1,
M.2 2280 B + M key x 1,
M.2 2230 E key x 1
Mini card x 1,
M.2 2280 B + M key x 1,
M.2 2230 E key x 1
Mini card x 1,
M.2 2280 B + M key x 1,
M.2 2230 E key x 1
Mini card x 1,
M.2 2280 B + M key x 1,
M.2 2230 E key x 1
power 12-60V 12-60V 12-60V 12-60V 12-60V
operation temp 32°F ~140°F
(0°C ~ 60°C)
32°F ~140°F
(0°C ~ 60°C)
32°F ~140°F
(0°C ~ 60°C)
32°F ~140°F
(0°C ~ 60°C)
32°F ~140°F
(0°C ~ 60°C)

Packing List

  • UPX-WHL01 with Heatsink + cooler

Optional Accessories

125530065A 19Vdc/3.42A.65W power adapter
1702031830 Power cord for USA
9741364A00 Wireless LAN Kit M.2 2230 802.11ac/a/b/g/n + BT4.0, 2T2R,with 2 sets of cable & antenna (Enli,QCNFA364A)
9741159H00 (TF)Wireless LAN kit.IEEE 802.11.b/g/n.w/BT 4.0/3.0.(AzureWave.AWNB159H). w/cable.& antenna (mini card)
PER-TAIX2-A10-2280 AI Core XM 2280.M.2 2280 B+M key card.with Dual Myriad X.15 mm heat sink with FAN
UPCP-CR-VPX3-A10-001 Vision Plus X.w/ 3x Myriad X 2485.fan heatsink.REV.A1.0
UPCP-CR-NPL4-A10-002 Net Plus.i210-IT.for UP core Plus.A1.0

UP-3GHAT

Overview

RS-232/422/485 x 2, Mini Card x 1, uSIM Card Reader x 1

Features

  • RS-232/422/485 x 2
  • Minicard x 1, uSIM Card Reader x 1
  • HAT 40-pin Header x 1
  • WiFi Module Header for x 1

Specifications [UP-3GHAT]

system
IC 2-CH FULL-SPEED USB UART x 1
USB 2.0 Hub x 1
RS-232/RS-485/RS-422 transceiver x 2
i/o placements
External Ports RS-232/422/485 Connector (DB9) x 1
Internal Connector RS-232 wafer (RS-232/422/485) x 1
USB wafer x 1
Minicard x 1
uSIM Card Reader x 1
HAT 40 GPIO male (4x GPIO, 3.3V, 5V, GND) x 1
WIFI LED x 1
3G LED x 1
Power LED x 1
others
Form Factor 2.56″ x 2.2″ (65 mm × 56 mm)
Certification CE/FCC Class A
Operating Temperature 32°F ~ 140°F (0°C ~ 60°C)
Operating Humidity 10%~80% RH, non-condensing
optional
WiFi Module UP-WIFIMD-A20-7001 (WiFi module: 7M02) UP-WIFIMD-A20-4001 (WiFi module: 4M02)
BT Module UP-BTMD-A20-0001
3G Module 9741UC20G0 (3G module: UC20-G)

Ordering Information [UP-3GHAT]

Part Number UP-3GHAT-A20-0001
description 3G HAT

Packing List

  • UP-3GHAT

UP-GWS01

Overview

Compact in Design: 95mm x 91mm x 37mm (WxLxH)

Palm-sized compact system design for space-constrained surroundings.

Flexible Connectivity

UP-GWS01 offers optional WIFI and BT modules and default Giga LAN. Designed to connect to cloud and server with ease.

IoT Support

Through powerful Intel® x5-Z8350 CPU plus various I/O expansion and connectivity, UP-GWS01 is fit for applications of all sizes. From factory automation gateway, security management, digital signage, to personal home application gateway.

Features

  • Intel® Atom™ x5-Z8350 SoC
  • Onboard DDR3L Memory
  • Onboard eMMC Storage
  • Gigabit LAN x 1, USB 2.0 x 4, USB 3.0 x 1, HDMI x 1
  • Optimized Fanless Cooling Design
  • Wi-Fi (Optional)
  • BT 4.0 (Optional)

Specifications [UP-GWS01]

system
CPU Intel® Atom™ x5-Z8350 Processor (2M Cache, 1.44 GHz up to 1.92 GHz) CPU with 64 bit architecture; Quad Core
Memory Onboard DDR3L memory
Graphics Intel® HD 400 Graphics ,12 EU GEN 8, up to 500MHz Support DX*11.1/12, Open GL*4.2, Open CL*1.2 OGL
ES3.0, H.264, HEVC (decode), VP8
Storage Onboard eMMC
Ethernet Gb LAN x 1
WIFI/BT Optional
Audio HDMI x 1
USB USB2.0 x 4, USB3.0 OTG x 1
Expansion Slot
i/o placements
Power DC-in Jack x 1
USB USB2.0 x 4, USB3.0 OTG x 1
DisplayPort HDMI x 1
Ethernet Gb LAN x 1
COM
environment
Power 5V/4A DC Only
Form Factor 3.74″ x 3.58″ x 1.46″ (95mm x 91mm x 37mm)
Gross Weight
Operating Temperature 32°F ~ 104°F (0°C ~ 40°C)
Operating Humidity 0% ~ 90% relative humidity non-condensing
Certification CE/FCC Class A
OS support Windows® 10, Linux, Android 6.0, Windows® 10 IoT core

Ordering Information [UP-GWS01]

Part Number UP-GWS01-A20-0232 UP-GWS01-A20-0432 UP-GWS01-A20-1232 UP-GWS01-A20-1432
description UP-GWS01, w/2G memory, 32G eMMC board w/o VESA plate UP-GWS01, w/4G memory, 32G eMMC board w/o VESA plate UP-GWS01, w/2G memory, 32G eMMC board w/ VESA plate UP-GWS01, w/4G memory, 32G eMMC board w/ VESA plate

Packing List

  • UP-GWS01

Optional Accessories

UP-WIFIKIT-A20-4001 WiFi module KIT, IEEE 802.11 a/b/g/n, 2.4GHz and 5GHz, w/ Cable and Antenna
UP-WIFIKIT-A20-7001 WiFi module KIT, IEEE 802.11 b/g/n, 2.4GHz, w/ Cable and Antenna
UP-BTKIT-A20-0001 Bluetooth module, 2.4GHz, w/ Cable and Antenna
1255300203 5V/4A Power Adapter
1709100802 USB 3.0 OTG cable, Micro B to Micro B

UP-POE HAT

Overview

AAEON, a leading developer of IoT solutions, is launching three separate expansion boards to complement its series of UP maker boards. The new products will add audio, camera, and PoE capabilities to the UP series.

The PoE I/O board enables Gigabit Ethernet, and it connects to the UP Board and UP Squared boards via a 40-pin GPIO. Its 5V DC port mean it can also connect to other SBCs.

The boards can be used individually or in combination, meaning users can pick and choose which functions they want to add to their systems.

These products make it easier than ever before for developers to create working applications. Functionality can be added simply by connecting a tried-and-trusted expansion board, saving on development time and costs, and leaving users free to innovate.

Features

  • IEEE802.3 AT Standard
  • Max 25W Power Supply
  • 10/100/1000 Mbps LAN
  • RJ45 Input x 1
  • RJ45 Output x 1

Specifications [UP-POE HAT]

system
IC LT4321I (PoE Ideal Diode Bridge Controller) x 1
LT4276B (PD Forward / Flyback Controller) x 1
i/o placements
External Ports RJ45 input x 1
RJ45 output x 1
Internal Connector HAT 40 GPIO male (5V, GND) x 1
others
Form Factor 3.37″ x 2.22″ x 0.98″ (85.6 mm x 56.5 mm x 25 mm)
Certification CE / FCC Class A
Operating Temperature 32°F ~ 140°F (0°C ~ 60°C)
OS support No OS limitation

Ordering Information [UP-POE HAT]

Part Number UP-POE-A20-0001
description POE board

Packing List

  • LAN cable
  • UP-POE HAT

UPS-GWS01

Overview

The UP Squared system is a complete system package featuring the powerful and fast UP Squared maker board. Designed for easy deployment in embedded applications from industrial automation to IIoT and AIoT, the UP Squared system brings high-performance in a low-power compact solution.

UP Squared is powered by Intel® Apollo Lake processors, delivering high performance at minimum power consumption. Its small size also makes it perfect for use in mobile applications including drone operations. UP Squared offers flexible OS support including Windows 10, Linux and Android.

UP Squared supports the AI Core X mPCIe module, which features Intel Movidius Myriad X. With speeds up to 105 fps (80 typical) and 1 trillion floating point operations, adding on the AI Core X to UP Squared creates a powerful, compact AI Edge solution. UP Squared with AI Core X has proven real-world performance, used by AAEON partners in applications from license plate recognition to drone-based visual inspections.

If you require a total AI solution, AAEON offers the “UP Squared AI Developer Kit”. This kit includes the UP Squared system with the AI Core X and an Ever Focus® USB camera. The “UP Squared AI Developer Kit” comes preloaded with Windows™ 10 and the Intel® OpenVINO™ toolkit. Be sure to inquire about the kit when speaking to your sales representative.

For developers looking for a board-level solution, check out the UP Squared board page.

Features

  • Intel® Pentium® N4200/ Celeron® N3350 Processor SoC/Atom® E3950
  • Onboard LPDDR4 Memory, eMMC Storage
  • Gigabit LAN x 2
  • HDMI x 1, DP x 1
  • USB 3.0 x 3, USB 3.0 OTG x 1
  • 3G/ WiFi/ BT(Optional)

Specifications [UPS-GWS01]

system
CPU Intel® Pentium® N4200/ Celeron® N3350 Processor SoC/ Atom® E3950
Memory Onboard Single/ Dual Channel LPDDR4 memory, Max. 8GB
Graphics Intel® Graphics, GEN 9
Storage eMMC ver 5.0 x 1, Max. 128G
Ethernet Realtek® 8111G x 2
WIFI/BT
Audio HDMI x 1, DP x 1
USB USB3.0 x 3
Expansion Slot Minicard (MINI card with SIM) socket x 1
i/o placements
Power DC-in Jack x 1, Power Button x 1
USB USB3.0 x 2, USB3.0 OTG x 1/ USB3.0 x 1
DisplayPort HDMI x 1, DP x 1
Ethernet Realtek® 8111G x 2
COM
environment
Power 5V DC Only
Form Factor 3.74” x 3.74” x 1.97” (95mm x 95mm x 50mm)
Gross Weight
Operating Temperature 32°F ~ 113°F (0°C ~ 45°C)
Operating Humidity 0% ~ 90% relative humidity non-condensing
Certification CE, FCC Class A, UL
OS support Windows® 10, Linux, Android 7.0, Windows® 10 IoT core

Ordering Information [UPS-GWS01]

Part Number UPS-GWS01C2F-A20-0232 UPS-GWS01C2F-A20-0432 UPS-GWS01C2F-A20-1232 UPS-GWS01C2F-A20-1432 UPS-GWS01P4F-A20-0432 UPS-GWS01P4F-A20-0864 UPS-GWS01P4F-A20-1432 UPS-GWS01P4F-A20-1864 UPS-GWS01X7F-0464-AI UPS-GWS01X7F-A20-0432 UPS-GWS01X7F-A20-0864
description UPS-GWS01, CPU N3350(F1), w/2G memory, 32G eMMC board w/o VESA plate UPS-GWS01, CPU N3350(F1), w/4G memory, 32G eMMC board w/o VESA plate UPS-GWS01, CPU N3350(F1), w/2G memory, 32G eMMC board w/ VESA plate UPS-GWS01, CPU N3350(F1), w/4G memory, 32G eMMC board w/ VESA plate UPS-GWS01, CPU N4200(F1), w/4G memory, 32G eMMC board w/o VESA plate UPS-GWS01, CPU N4200(F1), w/8G memory, 64G eMMC board w/o VESA plate UPS-GWS01, CPU N4200(F1), w/4G memory, 32G eMMC board w/ VESA plate UPS-GWS01, CPU N4200(F1), w/8G memory, 64G eMMC board w/ VESA plate UPS-GWS01.CPU E3950(F1).4GB memory.64GB eMMC.AI core X w/o OS UPS-GWS01, CPU E3950(F1), w/4G memory, 32G eMMC board w/o VESA plate UPS-GWS01, CPU E3950(F1), w/8G memory, 64G eMMC board w/o VESA plate

Packing List

  • UPS-GWS01

Optional Accessories

1702020910 Power cord for EU
1702020911 Power cord for US
1255300362 30W.5VDC/6A power adapter
PER-TAICX-A10-003 AI Core X mPCIe card with single Myriad X .w/o heat sink

UPX-Edge

Overview

The UP Xtreme Edge Computing System, or UPX-Edge for short, is a complete embedded system that’s ready to go out of the box. Built on the UP Xtreme board, UPX-Edge is powered by 8th Generation Intel® Core™ and Celeron® processors (formerly Whiskey Lake) with up to 16GB of onboard RAM and 64GB of eMMC memory to power through any application. With the latest Intel® graphics solution, the UPX-Edge is capable of 4K video output, and features a built-in audio jack as standard.

The UPX-Edge is designed with key industrial I/O features for flexibility and easy integration with existing infrastructure. I/O ports include two external GPIO connections, two COM ports, and four USB 3.2 Gen 1 ports. The UPX-Edge can also hold up to extreme conditions, with an operating temperature range of -20°C to 70°C (tested with AI Core M 2280, 2x Intel® Movidius™ Myriad™ X).

UPX-Edge makes deploying a powerful edge system easy, whether it’s as a factory IoT gateway, AI powered machine controller, or in a smart retail application.

Features

  • Intel® WHL-U Core™ i7/i5/i3/Celeron Processor SoC
  • Onboard DDR4 memory, Max 16GB
  • eMMC 64GB
  • HDMI 2.0 x 1 (Support 4K at 60 Hz)
  • COM ports (RS-232/422/485) x 2
  • 16pin GPIO connectors (1x GPIO for SMT32, 1x GPIO for 40pin HAT)
  • Audio Jack x 1 (line out + Mic)
  • 12-60V DC-in
  • Fanless Chassis design

Specifications [UPX-EDGE]

system
CPU 8th generation Intel Core i7/i5/i3/Celeron Processor SoC
Memory Onboard DDR4 memory, Max 16GB
Single Channel: 4GB
Dual Channel: 8GB, 16GB
Graphics Intel® Graphics , GEN 9
Storage eMMC 64GB
Ethernet i7/i5 SKU LAN (i210 AT) x 1, LAN (i219 LM) x 1
i3/Celeron® LAN (i210 AT) x 1, LAN (i219 V) x 1
WIFI/BT Optional
Audio Line out + MIC x 1
USB USB 3.2 Gen 2 x 4
Expansion Slot M.2 2230 E Key x 1
M.2 2280 M Key x 1
mPCIe slot x 1
100pin connector x 1
40 pin HAT x 1
SATA3 connector x 1 (support 2.5” HDD/SSD expansion)
i/o placements
Power DC-in Jack x 1, Power Button x 1
USB USB 3.2 Gen 2 STACK Connector for 2 ports (Front) x 1
USB 3.2 Gen 2 STACK Connector for 2 ports (Rear) x 1
DisplayPort HDMI 2.0 x 1 (Support 4K at 60 Hz), DP 1.2 x 1,
16pin GPIO connectors (1 x GPIO for SMT32, 1 x GPIO for 40pin HAT)
Ethernet RJ45 connector x 2
COM RS-232/422/485 x 2
environment
Power 12V – 60VDC
Form Factor 7.48” x 5.12” x 3.1” (190mm x 130mm x 78.6mm)
Gross Weight 6.61lbs (3kg)
Operating Temperature eMMC: 32°F ~ 140°F (0°C ~ 60°C)
SATA: -4°F ~ 158°F (-20°C ~ 70°C)
With AI module: 32°F ~ 140°F (0°C ~ 60°C)
Operating Humidity 0% ~ 90% relative humidity, non-condensing
Certification CE/FCC Class A, RoHS Compliant, REACH
OS support Win 10, Linux Ubuntu 18.04 with Kernel 5.0, Linux Yocto 2.7 with Kernel 4.19

Ordering Information [UPX-EDGE]

Part Number UPX-EDGECR-A10-0464-F01 UPX-EDGECR-A10-0464-FX1 UPX-EDGEI3-A10-0864-F01 UPX-EDGEI3-A10-0864-FX1 UPX-EDGEI5-A10-0864-F01 UPX-EDGEI5-A10-0864-FX1 UPX-EDGEI7-A10-1664-F01 UPX-EDGEI7-A10-1664-FX1 UPX-EDGEI7C1-A10-1664-F01
cpu Celeron® 4305UE Celeron® 4305UE Core™ I3-8145UE Core™ i3-8145UE Core™ I5-8365UE Core™ i5-8365UE Core™ I7-8665UE Core™ i7-8665UE Core™ I7-8565U
ram 4GB 4GB 8GB 8GB 8GB 8GB 16GB 16GB 16GB
storage 64GB 64GB 64GB 64GB 64GB 64GB 64GB 64GB 64GB
lan GbE x 2 GbE x 2 GbE x 2 GbE x 2 GbE x 2 GbE x 2 GbE x 2 GbE x 2 GbE x 2
usb USB 3.2 Gen 2 x 4 USB 3.2 Gen 2 x 4 USB 3.2 Gen 2 x 4 USB 3.2 Gen 2 x 4 USB 3.2 Gen 2 x 4 USB 3.2 Gen 2 x 4 USB 3.2 Gen 2 x 4 USB 3.2 Gen 2 x 4 USB 3.2 Gen 2 x 4
rs-232/422/485 2 2 2 2 2 2 2 2 2
power 12-60V 12-60V 12-60V 12-60V 12-60V 12-60V 12-60V 12-60V 12-60V
operation temp -4°F ~ 158°F (-20°C ~ 70°C) -4°F ~ 158°F (-20°C ~ 70°C) -4°F ~ 158°F (-20°C ~ 70°C) -4°F ~ 158°F (-20°C ~ 70°C) -4°F ~ 158°F (-20°C ~ 70°C) -4°F ~ 158°F (-20°C ~ 70°C) -4°F ~ 158°F (-20°C ~ 70°C) -4°F ~ 158°F (-20°C ~ 70°C) eMMC: 32°F ~ 140°F (0°C ~ 60°C)
SATA: -4°F ~ 158°F (-20°C ~ 70°C)
With AI module: 32°F ~ 140°F (0°C ~ 60°C)
others With foundation kit image preload, AI Core X 2280 With foundation kit image preload, AI Core X 2280 With foundation kit image preload, AI Core X 2280 With foundation kit image preload, AI Core X 2280

Packing List

  • VESA Kit
  • DIN-RAIL Kit
  • SATA cable
  • Screw packs
  • UPX-EDGE

Optional Accessories

125530065A 19Vdc/3.42A.65W power adapter
1702031830 Power cord for USA
9741364A00 Wireless LAN Kit M.2 2230 802.11ac/a/b/g/n + BT4.0,2T2R,with 2 sets of cable & antenna (Enli,QCNFA364A)
PER-TAIX2-A20-2280 AI Core XM 2280.N/A.M.2 2280 B+M key card. with Dual Myriad X
9741159H00 (TF)Wireless LAN kit.IEEE 802.11.b/g/n.w/ BT 4.0/3.0.(AzureWave.AW-NB159H).w/ cable.&antenna (mini card)
9741EC25E0 (TF)PCIe mimi card.4G LTE.module kit .for Europe.W/Cable & antenna.Quectel EC25-E